HONIQUE
The HONIQUE process is designed for direct metallization of plastic, omitting the metal coating step in chemical processes. Copper electroplating from acid copper bath takes place immediately after the process of surface preparation and activation. HONIQUE does not contain highly complexing compounds.
The advantages of the HONIQUE:
• Suitable for plating on ABS, ABS/PC 65%
• Elimination of electroless Cu and Ni
• Elimination of Cu or Ni Strike
• Better, faster coverage
• Wider working window
• Pd reduction in the activator working bath
• Simple Integration in existing line
• Increased production reliability
• Short process – high productivity
• Less waste water
• No rack plating