CUMATT is an acid copper plating system that produces fine crystalline, satin and ductile deposits. Specially formulated the acid copper system affords simple operation by means of a one component, sulfur-free additive that is highly effective in low concentrations and extremely stable under a wide range of current densities and temperatures. Production-proven in both horizontal and vertical processes, the acid copper may be used with insoluble or soluble anodes. The CUMATT satin deposit provides a microroughened topography. The lower reflectivity provides uniformity for optical inspection. CUMATT acid copper is easily controlled using CVS or Hull Cell analysis. Due to its sulfur-free additive, the acid copper produces a deposit with low included organics. This results in the lowest internal stress possible and the most consistent deposit characteristics. The final deposit yields the highest conductivity while exhibiting no change in physical properties before and after annealing.